SCREEN releases DW-3100, a new direct imaging system delivering industry-leading precision - New model accelerates the evolution of semiconductor packaging with advanced direct imaging technologies
SCREEN will be participating at the "SEMICON Japan 2025", held at Tokyo Big Sight for 3 days from December 17th (Wednesday) to 19th (Friday). Our representatives look forward to welcoming you all at our booth.
SCREEN Semiconductor Solutions Co., Ltd. (SCREEN SPE) has finalized development of the DW-3100, a cutting-edge direct imaging system for advanced semiconductor packages. Sales of the new system will begin this month.