OSCI has recently published their TLM-2.0 technology which provides for interoperability between SystemC models of electronic components whose primary interfaces are memorymapped busses. This is a ...

With the advent of System-on-Chip technology, designs are becoming bigger in size and thus highly complex, time-to-market is becoming critical, and at the same time, RTL methodologies are generally ...

As the VLSI process technology continuously advances, the System-on-Chip (SoC) design methodology has become a main design trend for semiconductor products. A single ...

PORTLAND, ORE. — November 9, 2004 — Open Core Protocol International Partnership (OCP-IP) today announced an updated version of their OCP 2.0 compliant transactional models implemented in SystemC.

SAN JOSE, Calif.--(BUSINESS WIRE)--April 3, 2006--CoWare(R) Inc., the leading supplier of electronic system-level (ESL) design software and services, announced it has added new IP models to the CoWare ...

Would-be users of transaction-level models (TLMs) and electronic system-level (ESL) design approaches in general face a major hurdle. Traditionally, it has been difficult to construct TLMs that serve ...

THAME, England--(BUSINESS WIRE)--The Open Virtual Platforms (OVP) initiative (www.OVPworld.org) has announced the release of a reference virtual platform of the ARM Integrator development board using ...

This marks the 10 th DAC that I have covered as a blogger. At DAC 2008 in Anaheim, the industry had just come together behind the SystemC TLM 2.0 standard to enable virtual platforms, finally getting ...

System-Level Design moderated a discussion about the future of SystemC with Thomas Alsop, corporate design solution expert at Intel; Ambar Sarkar, chief verification technologist at Paradigm Works; ...

The use of simulation models provides an important starting point for SoC architectural exploration, using virtual platforms to test application workloads and datasets to optimize multicore ...