COMSOL Multiphysics version 6.4 accelerates engineering simulations and multiphysics models. Full GPU support across all ...

COMSOL Multiphysics software lets you model just about anything from electromagnetic fields to structural mechanics and chemical reactions. While many of its capabilities fall outside the interest to ...

COMSOL Multiphysics® version 6.4 introduces new and updated functionality as well as the new Granular Flow Module, based on the discrete element method (DEM), for simulating grain and powder flow. The ...

Abstract: In this work, we propose an electro-magnetic and thermal 3D-Finit-Element Modeling and simulation methodology, under COMSOL Multiphysics, applied to a phase-leg high current power modules ...

The latest version of the multiphysics simulation software introduces GPU acceleration through NVIDIA CUDA’s direct sparse solver, the Granular Flow Module, and time-explicit structural dynamic ...

Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...

It’s surprising to learn that the idea of 3D integrated circuits (3D ICs) has been kicking around for over sixty years. Not long after the first MOS IC emerged in 1960, researchers were already ...

The high power consumption of electronic systems, driven by applications in Artificial Intelligence (AI) and High-Performance Computing (HPC), is generating a significant demand to address overheating ...

Did you know that anyone can now access over 100 on-demand learning resources designed to advance your modelling and simulation skills? Whether you want to advance your existing knowledge or learn how ...

Contractors can predict the potential outcome of a concrete casting process by using the maturity method, but it can be difficult to apply this technique in the field. This is why Heidelberg Materials ...

3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, ...